Wafer Fabrication & PCB Packaging Development Manager - (US-MA-Boston - 02298)

Compensation: $100K - $160K / Year
Minimum Education: Bachelors
Job Type: Full Time
Jobcode: 1663
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Seeking Ph.D. in Mechanical Engineering, Physics, Materials Science, or related discipline with at least 10 years direct experience in the microelectronics industry who has broad understanding of advanced packaging methodologies and is familiar wafer fabrication techniques.

Contact Philippe Villavicencio at
609-584-9000 x 255

Or apply online at
http://dmc9.com/pyv/app.asp

Or email to:
1000001663_10007230@candseek4.com